Electronic Component Section Analysis

Purposes: 

With the development of technology and process, electronic products is more and more miniaturization, complication and systematization, and its function is more and more powerful, integration is more and more high, the volume becomes smaller and smaller. Cross section analysis is with the aid of slice analysis technology and the high rate of microscope to confirm the electronic components failure phenomena, analysis process, raw material defect.

Applications:

Electronic components, communications, electronics, LED, sensors, etc

Test flow：

Take samples→Cleaning→Vacuum mosaic→Grinding→Polishing→Observe

Reference standard:

IPC-TM 650 2.1.1 , IPC-TM 650-2.2.5 etc.

Typical test images:

LED the second binding point
Ceramic capacitor poor welding	Internal structure crack of ceramic capacitor