400-850-4050

X-ray Inspection

 

X-Ray C-SAM

 

Brief introduction:

X - Ray is using a cathode Ray tube to produce high energy electron striking a metal target. In the process of impact, because of the sudden slowdown of electronic, the loss of kinetic energy will be released in the form of X - Ray.

 

Purposes:

To test the internal cracks and defects of foreign body in metal materials and parts, plastic materials and parts, electronic components, electronic components, LED components; analyze the internal displacement in BGA and circuit boards; distinguish BGA welding defects such as empty welding, pseudo welding; analyze the internal situation of microelectronic systems and rubber seal components, cables, fittings, plastic pieces etc.

 

Applications:

IC, BGA, PCB/PCBA, and surface-mount technology weldability test etc.

 

Reference standard:

IPC-A-610 ,GJB 548B

 

Typical test images:

 

BGA空洞 BGA锡球开裂
BGA voids BGA tin ball cracking
PCB线路断开 IC缺陷检测
PCB line disconnection Check the IC defect


  • Contact Us
  • MTT Shenzhen

    Tel: 400-850-4050

    Fax: 0755-2782 1672

    Email: marketing@mttlab.com

     

    MTT Suzhou

    Tel: 400-118-1002

    Fax: 0512-6275 9537

    Email: marketing@mttlab.com

     

    MTT Shanghai

    Tel: 400-118-1002

    Email: marketing@mttlab.com

     

    MTT Dongguan

    Tel: 400-116-1002

    Email:marketing@mttlab.com

Shenzhen Meixin Testing Technology Co., Ltd.

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