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New Materials / New Process Evaluation

 

Materials industry is the basic industry of the national economy, the new material is a precursor material for industrial development, is an important strategic emerging industries. As one of the three key technologies of the 21st century, new material is bred in the areas of new technologies, new products, new equipment, "cradle." The new material appears essential to analyze the needs of discriminating its performance, applications, and other values.

 

Meixin Testing detected as a focus on testing and analysis of materials and spare parts professional third party laboratory, with many years of testing, analysis experience to help the development of R & D units of quality evaluation of new materials / new technology to help buyers in accordance with the relevant standards or specification validate key technical parameters of new materials, issued by the authority detection, analysis reports.

 

New materials / new processes involved are:

New electronic information materials, such as: high thermal / thermal material, printed circuit board materials, integrated circuits and semiconductor materials, electronic materials, etc.

High-end metal structural materials, such as: high-quality special steel, high-strength alloys, etc.

Advanced polymer materials, such as: special rubber, engineering plastics, functional membrane materials, high-performance platinum, silicon and other materials as well as high-end paint, etc.

New inorganic non-metallic materials, such as: advanced ceramic materials, special glass, artificial crystal, superhard materials, new electronic materials, etc.

High-performance composite materials, such as: resin-based composites, carbon-carbon composites, ceramic matrix composites, metal matrix composites, etc.

Forefront of new materials, such as: nano-materials, bio materials, smart materials, superconducting materials, etc.

 

New materials / new technology means test analysis involves:

Chemical composition analysis

Surface / interface morphology characterization and composition analysis

Mechanical / physical performance test

Non-destructive structural analysis

Thermal Performance / Thermal parameters analysis

Electrical tests

Special parameter characterizing

Material specifications prepared

 

New materials / new technology test analysis based on:

Existing standards or negotiated test methods, material specifications and so on.

 

Example of new material quality evaluation:

1. Metal base copper clad laminate

Standards:CPCA 4501—2010 Metal base copper clad laminate for printed circuit

Parameter:

 

Test item Unit Test method  GB/T 4722 requirement
LALA-01 LALB-01 LALC-01 LALD-01

1.Thermal conductivity

(insulation layer and layer)λa

W/(m.K) Appendix CA λ≤1.0 1.0<λ≤1.5 1.5<λ≤2.0 2.0<λ≤3.0
2.Thermal resistance a,Not more than K.m2/W Appendix A 2.0×10-4 1.0×10-4 0.7×10-4 0.5×10-4
3. Peel strength ,no less than
A. After the thermal stress(288℃,10s)
B. At high temperature(125℃)
N/mm

16.4

16.9

1.05
0.7
1.05
0.7
1.05
0.7
1.05
0.7

4.flammability

(vertical burning test)

rank 26.5 FV-0 FV-0 FV-0 FV-0

5.heat stress

(not etching),

288℃,120s

- 17 No delamination no blister

6.Glass transition temperature

(alternatives)

Appendix C The supply and demand both sides agreement

7.dielectric constant

(A state)a(alternatives),1MHz

- Appendix C The supply and demand both sides agreement

8.Tangent of dielectric lose angle

(A state)a(alternatives),1MHz

- Appendix C The supply and demand both sides agreement

9.volume resistivity

(C-96/35/90),no less than

MΩ.cm Appendix C

106

106

106

106

10.surface resistivity

(C-96/35/90),no less than

Appendix C

104

104

104

 

104

11.breakdown voltage

(perpendicular)a,no less than

A

B

C

kV Appendix C

2

4

6

2

4

6

2

4

6

2

4

6

12.CTI

(alternatives)



V 10 CTI≥600V
400V≤CTI<600V
175V≤CTI<400V
13.water absorption % 27 1.5 1.5 1.5 1.5

14.chemical resistance

(alternatives)

- Appendix C No delamination no blister、no obvious change in appearance

15.Thermal shock after cutting

(alternatives)

- Appendix B

No delamination no blister

 

2. Conductive Silver

Test evaluation basis: Material Specification

Key parameters Example:

1. Filling: Silver

2. Solid content (wt%): 60-75

3. Density (g / cm³): 2.5-3.0

4. Viscosity (CPS): 10,000-20,000 (NDJ viscometer, 4 # 3rpm @ 25 ℃)

5. The coating area (cm² / g) (depending on film thickness) 100-200

6. square resistance (mΩ / □ / 25.4μm): <12

7. Adhesion (3M600 / 810 tape, vertical pull): No shedding

8. Hardness:> 2H

9. flexibility: △ R <2Ω (wire width of 1mm, 2 kgf reverse fold Fenzhong × 10 × 1 times)

10. Long-term working temperature (℃) <120

 

3. The anti-corrosion materials

Test evaluation basis: supply and demand sides confirmed

The key parameters required Example:

 

No. item performance evaluation Test method
1 film-substrate pe flake materials -
2 The base film color black -
3 Thickness of base film (mm) ≥0.2 GB/T 6672
4 Overall thickness (mm) ≥1.0 -
5 Basal membrane tensile strength (MPa) ≥18 GB/T 13022
6 Basal membrane elongation at break (%) ≥200 GB/T 13022
7 peel strength (N/cm),
or primer on steel
≥20 GB/T 2792
peel strength (N/cm),
for backing
≥20 GB/T 2792
8 electric strength (MV/m) ≥30 GB/T 1408.1
9 volume resistivity Ω•m ≥1×1012 GB/T 1410
10 heat-proof aging (%) ≥75 SY/T 0414 appendix A
11 water absorption (%) ≤0.2 SY/T 0414 appendix B
12 water vapour permeability (mg/24h.cm2) ≤0.45 GB/T1037
13 ultraviolet aging resistance(600h)c, % ≥80 GB/T 23257 appendix F


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