Intermetallic Compounds

Background:

In recent years, with the lead-free requirements in electronics industry, the study of interface reaction between lead-free solders using Sn as matrix and substrate is increasing. In electronic products, copper is often used as the substrate material, and the interface reaction between the solder and the copper substrate during welding and service is a research topic that attracted wide attention. Because of the higher content of Sn in the Sn-Ag-Cu lead-free solder, the welding temperature is higher, which lead to the dissolution rate of Cu and the growth rate of the interfacial intermetallic compound are much higher than the solders of the Sn-Pb system. The related research shows that the morphology and growth of intermetallic compound between the solder joint and the metal contact have very important influence on the initiation and development of the solder joint defect and the reliability of the electronic assembly.

Application range:

PCBA, PCB, FPC, etc.

Tested Flow：

After cutting, mosaic, girding, polishing and etching, the tested samples will be sputtered Pt on surfaces and put into SEM vacuum chamber to observe and measure according to standard SEM operation procedure.

Reference Standard：

JY/T 010-1996 General rules for analytical scanning electron microscopy

GB/T 17359-2012 Microbeam analysis-Quantitative analysis using energy dispersive spectrometry

Typical pictures: